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IPC A-20/21-GKIT

IPC A-20/21-GKIT Standard Pitch Stencil Pattern for Slump Evaluation (Electronic Gerber Files)

standard by Association Connecting Electronics Industries,

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Provided electronically, these Gerber Files include patterns for developing solder paste stencils by lasar or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump.

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