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GMW16898 2nd Edition, November 2018 ...
GMW18095 1st Edition, November 2018 ...
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IEC 62676-2-32 Ed. 1.0 b:2019 Video surveillance systems for use in security applications - Part 2-32: Recording control and replay based on web services standard by International...
IEC 62676-2-31 Ed. 1.0 b:2019 Video surveillance systems for use in security applications - Part 2-31: Live streaming and control based on web services standard by International...
IEC 61158-6-26 Ed. 1.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-26: Application layer protocol specification - Type 26 elements standard by
IEC 61158-6-25 Ed. 1.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-25: Application layer protocol specification - Type 25 elements standard by
IEC 61158-6-23 Ed. 2.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-23: Application layer protocol specification - Type 23 elements standard by
IEC 61158-6-21 Ed. 2.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-21: Application layer protocol specification - Type 21 elements standard by
IEC 61158-6-19 Ed. 4.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-19: Application layer protocol specification - Type 19 elements standard by
IEC 61158-6-12 Ed. 4.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-12: Application layer protocol specification - Type 12 elements standard by
IEC 61158-6-10 Ed. 4.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-10: Application layer protocol specification - Type 10 elements standard by
IEC 61158-6-4 Ed. 3.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-4: Application layer protocol specification - Type 4 elements standard by
IEC 61158-6-2 Ed. 4.0 en:2019 Industrial communication networks - Fieldbus specifications - Part 6-2: Application layer protocol specification - Type 2 elements standard by
IEC 60749-20-1 Ed. 2.0 b:2019 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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